German multinational chemical company Wacker Chemie AG has unveiled plans to significantly increase its capacity for cleaning semiconductor-grade polysilicon.
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The company intends to establish a new production line at its Burghausen site by early 2025, resulting in a capacity boost of over 50%.
Polysilicon chip etching plays a critical role in ensuring the necessary surface purity for semiconductor applications.
With a projected capital expenditure of over €300 million, this expansion will not only create more than 100 new jobs at WACKER’s Burghausen site but also additional employment opportunities at partner companies.
In addition to expanding capacity, the project includes substantial investments in research and innovation.
The goal is to further enhance the purity of polysilicon through advanced and highly automated processes, enabling semiconductors to meet increasingly stringent design requirements and unleashing even greater chip performance.
WACKER has applied for funding under the EU’s Important Projects of Common European Interest (IPCEI) program, and the European Commission has granted approval under state aid law on June 8, 2023.
Pending approval from the German Ministry of Economic Affairs and Climate Protection, WACKER anticipates receiving funding of up to €46 million.
WACKER POLYSILICON aims to double its sales with semiconductor-sector customers by 2030, with approximately €100 million allocated for investment each year in the coming years.
The cleaning process for polysilicon chunks, used as the starting material for semiconductor wafers, is complex and technically demanding.
It involves the use of strong acids in an etching process to remove the uppermost layer from the polysilicon surface. The purified polysilicon is then packaged under cleanroom conditions for delivery to customers.
Leveraging state-of-the-art technologies and a high level of automation, the new facilities will achieve a surface purity that already meets the stringent demands of future generations of semiconductor wafers. ■